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Keyword: "flip chip bonders"
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Top site for "flip chip bonders": palomartechnologies.com

Title: Wire Bond, Gold Wire Bonder | Palomar Technologies
Description:
Wire Bond - Palomar Technologies provider of precision microelectronic automation packaging and assembly systems and contract assembly services.

Approx. monthly SE traffic: 3.31K
Approx. monthly SE traffic cost equivalent: $4.44K

Avg.CPC: $2.36
Searches: 58
Broad Searches: 73
Niche value (searches * cpc): $136.88

"flip chip bonders" related keywords

Keyword Searches Avg. CPC Searches*CPC Results
flip chip bonders 58 $2.36 $136.88 90.90K
flip chip bonder 480 $2.04 $979.2 10.60K

"flip chip bonders" related sites

IP: 64.183.9.237
Rank: $4.44K
Traffic: 3.31K

 Palomartechnologies.com: Wire Bond, Gold Wire Bonder | Palomar Technologies

Wire Bond - Palomar Technologies provider of precision microelectronic automation packaging and assembly systems and contract assembly services.

Keywords: 

wire bonding; bonder; bonder; palomar; palomar; wire bond; flip chip bonding; flip chip bonding; bonders; multi chip module;
Positions count: 107
IP: 140.98.193.112
Rank: $778.09K
Traffic: 953.51K

 Ieeexplore.ieee.org: IEEE Xplore: Guest Home Page

650000 on-line articles from 12000 journals or conferences. Different levels of subscription are possible.

Keywords: 

www goo; computer; pichunter; pichunter; ieee; ieee xplore; ieee xplore; norisbank; www goo; mg zr;
Positions count: 130.37K

 Firstlevelinc.com: First Level Inc. - Technology Based Contract Manufacturing Facility

First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.

Adtexts count: 5; AdTraffic: 591.48; Adwords budget: $1.27K;
IP: 216.39.57.105
Rank: $0.06
Traffic: 1.12

 Engentaat.com: System in Package Small Form Factor Micro-Electronics Assembly

Keywords: 

flipchip international; new generation technologies; aat technologies;
Adtexts count: 9; AdTraffic: 581.09; Adwords budget: $1.24K; Positions count: 3
Rank: $33.68
Traffic: 7.3

 Gcemarket.com: Used / Refurbished Wafer Processing and Automated Test Equipment Supplier

Leading Supplier of Refurbished/Used Equipment for Semiconductor, Opto, Mems, & Nano Industries Worldwide !

Keywords: 

refurbished semiconductor equipment; used semiconductor test equipment;
Adtexts count: 11; AdTraffic: 60.48; Adwords budget: $50.99; Positions count: 2
IP: 204.3.139.231
Rank: $393.94
Traffic: 326.59

 Creativematerials.com: Creative Materials Incorporated

Creative Materials Incorporated develops and markets highly conductive adhesives, coatings and inks that can be applied to a variety of substrates with extraordinarily high print definition.

Keywords: 

creative materials; conductive ink; b stage epoxy; conductive inks; anisotropic conductive adhesive; conductive spray; touch screen materials; silver conductive ink; fine line ink; materials data sheets;
Adtexts count: 49; AdTraffic: 1.35K; Adwords budget: $1.14K; Positions count: 10
IP: 71.29.0.234
Rank: $2.36K
Traffic: 2.43K

 Topline.tv: Dummy Components. Genuine TopLine Daisy Chain Dummy Lead Free Dummy Components for SMD training, Machine evaluation. Pb Free. RoHS Compliant. Best dummy components in town. BGA, CSP, WL-CSP, QFN, QFP,

Dummy Components. Genuine TopLine Daisy Chain Lead Free Dummy Components for SMD training, Machine evaluation. Pb Free. RoHS Compliant. Best dummy components in town. BGA, CSP, WL-CSP, QFN, QFP, TQFP, LQFP, PLCC, SO, SOIC, SSOP, TSOP, TSSOP, QSOP, flip chip

Keywords: 

topline; top line; tsop; qfp 208; dummy bga; pin grid array; electronic industry; to92; smt process; smd machine;
Adtexts count: 32; AdTraffic: 1.21K; Adwords budget: $1.61K; Positions count: 88
Rank: $9.34K
Traffic: 16.27K

 Set-sas.fr: SET - Smart Equipment Technology: Explore the World of Absolute Bonding Precision !

SET offers flexible systems able to align and bond components at less than 1 µm post bond accuracy. SET's chip-to-chip, chip-to-wafer & flip chip bonders adapt all bonding technologies.

Keywords: 

kadett; fc 150; flip chip bonder; hot embossing; www set com; nanoimprinting; photonics packaging; flip chip bonders; equipment set; smart equipment technology;
Positions count: 20
IP: 72.32.80.193
Rank: $10.89K
Traffic: 6.58K

 Bidservice.com: Used and Reconditioned Semiconductor and Scientific Equipment for sale!

Used and Reconditioned scientific, semiconductor manufacturing and laboratory equipment.

Keywords: 

disco equipment; bid; bid services; bid services; blue m; blue m oven; thermotron; bid services; bid services; refurbished microscopes;
Adtexts count: 316; AdTraffic: 13.88K; Adwords budget: $27.70K; Positions count: 376
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